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Advanced wet-chemical process equipment
for the smaller-substrate world...

ClassOne Technology designs and manufactures new advanced wet-chemical process tools -Electroplating Tools, Spray Solvent Tools, and Spin Rinse Dryers - especially for the cost-sensitive producers of MEMs, Power Devices, RF, LEDs, Photonics, Sensors, Microfluidics and other emerging technologies. While these market segments have long been underserved or ignored by the larger equipment manufacturers, ClassOne Technology is focused on providing the high-quality wet process and electroplating equipment you require.

We provide innovative new solutions for a range of applications on 3" to 8" substrates of many materials, including silicon, glass, sapphire, GaAs, GaN, Ge, InP and HgCdTe. We make electroplating equipment for development and high-volume production, batch spray solvent processors, spin rinse dryers, and more... and we’d love to serve you! Learn more...



  • Customer demo ongoing this week in our Apps Lab on our Solstice Electroplating Tool! 1 week 5 days ago
  • TSV Plating (Through Silicon Via Plating). Learn about the Solstice LT and S8 for Cu TSV Plating: 3 weeks 2 days ago
  • Plating for Wafer Level Packaging (Cu Pillar Plating, Cu Bump Plating, Barrier Plating) - Learn more at: 3 weeks 2 days ago