• Products
    • Solstice Max
    • Solstice S-Series
  • Technologies
    • Advanced Packaging
      • Copper TSV Fill Plating
      • Copper RDL Plating
      • Copper Pillar Plating
      • Multi Metal Stack Pillar
    • Seed And Barrier Etch
      • UBM and Patterned Metal Wet Etch
    • Solvent Processing
      • Photoresist Strip Process
      • Metal Lift-Off (MLO)
    • Back End Cleans
      • RCA Cleans (SC1/SC2)
      • Piranha (SPM)
    • Advanced Gold Plating
      • Fine Feature Gold Fill
      • Gold Deplating
      • Gold TWV Plating
      • Through Mask Gold Plating
    • Emerging Technologies
      • TGVs
      • Indium Bump Plating
      • Hybrid Bonding
      • Glass Interposers
  • Markets
    • Advanced Packaging
    • Photonics
    • Artificial Intelligence
    • MEMS and Sensors
    • RF & Power Devices
  • Resources
  • Company
    • About Us
    • News & Events
    • Contact Us
  • Products
    • Solstice Max
    • Solstice S-Series
  • Technologies
    • Advanced Packaging
      • Copper TSV Fill Plating
      • Copper RDL Plating
      • Copper Pillar Plating
      • Multi Metal Stack Pillar
    • Seed And Barrier Etch
      • UBM and Patterned Metal Wet Etch
    • Solvent Processing
      • Photoresist Strip Process
      • Metal Lift-Off (MLO)
    • Back End Cleans
      • RCA Cleans (SC1/SC2)
      • Piranha (SPM)
    • Advanced Gold Plating
      • Fine Feature Gold Fill
      • Gold Deplating
      • Gold TWV Plating
      • Through Mask Gold Plating
    • Emerging Technologies
      • TGVs
      • Indium Bump Plating
      • Hybrid Bonding
      • Glass Interposers
  • Markets
    • Advanced Packaging
    • Photonics
    • Artificial Intelligence
    • MEMS and Sensors
    • RF & Power Devices
  • Resources
  • Company
    • About Us
    • News & Events
    • Contact Us

Semiconductor Electroplating Systems

Solstice Series

Solstice S8 semiconductor plating system angle view

Solstice S8

Automated Electroplating Systems

Advanced, single-wafer, high-throughput ECD and Surface Preparation – with up to eight chambers

Solstice S4 electroplating system

Solstice S4

Automated Electroplating Systems

Advanced, single-wafer, high-throughput ECD and Surface Preparation – with up to four chambers

Solstice LT semiconductor plating equipment front view

Solstice LT

Electroplating Development Systems

Semi-automated single-wafer Process
Development – with up to three chambers

 

Trident Series

Let’s Talk

We listen and respond to your unique challenges to provide the right technology at the right time and meet your manufacturing goals. Reach out, and we’ll deliver a solution.

Request Info
  • Products
    • Solstice Max
    • Solstice S-Series
  • Technologies
  • Markets
    • Advanced Packaging
    • Photonics
    • Artificial Intelligence
    • MEMS and Sensors
    • RF & Power Devices
  • Resources
  • Company
    • About Us
    • News & Events
    • Contact Us

ClassOne Technology Inc.

109 Cooperative Way

Kalispell, Montana, 59901

United States

+1 406 407 7814